Huawei is outlining an ambitious long-term roadmap for its next-generation Ascend silicon, targeting significant computational and hardware leaps over the next several years. The upcoming lineup aims to address expanding processing demands by steadily enhancing core performance and memory capacity.
The progression kicks into gear in 2027 with the next-gen Ascend 960, which is set to deliver a major boost to inference capabilities. Following that, Huawei plans to introduce the Ascend 970 in 2028, expanding the memory envelope significantly up to 288 GB.
Looking further ahead to 2029, the roadmap features the Ascend 980, which is slated to push memory capacity even higher to 384 GB. This steady rollout schedule underscores Huawei's strategy to continuously scale its custom hardware architecture throughout the late 2020s.
For full details and technical breakdowns, please check the original report on Wccftech.
